The Yamaha YSB55w flip-chip bonder achieves two times the bonding accuracy and three times the productivity of conventional models. This brings a New Era in Semiconductor packaging for the expanding flip chip market. - Ultra high throughput including process time: 13,000 UPH - High placement accuracy : /-5µm (3sigma) - Dual bonding heads : 8-nozzles x 2-heads - Handles a wide range of die sizes: 2mm square to 30mm square. Review more details provided links below. - YouTube Link : https://youtu.b
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The Yamaha YSB55w flip-chip bonder achieves two times the bonding accuracy and three times the productivity of conventional models. This brings a New Era in Semiconductor packaging for the expanding flip chip market. - Ultra high throughput including process time: 13,000 UPH - High placement accuracy : /-5µm (3sigma) - Dual bonding heads : 8-nozzles x 2-heads - Handles a wide range of die sizes: 2mm square to 30mm square. Review more details provided links below. - YouTube Link : https://youtu.b
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