IEEE

Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide ...

Abstract: We propose a technology called BBCube 3D for AI and HPC applications, which need high bandwidth and power efficiency. BBCube 3D is constructed by heterogeneous 3D integration in which xPU ...
IEEE

Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on ...

Abstract: We propose a technology called Bumpless Build Cube (BBCube) 3D for AI and HPC applications which need high bandwidth and power efficiency. BBCube employs bumpless Wafer-on-Wafer (WoW) ...
The Business Journals

Winn-Dixie rolls out plastic-negative ice production

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. Preview this article 1 min The company partnered with ...