SAN FRANCISCO — Agilent Technologies Inc. will reveal the latest version of its Advanced Design System tools at the Penton Wireless Systems Design Conference this week. The company's ADS2002 ...

AUSTIN, Texas, & SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) and NI (NASDAQ: NATI) today announced a broad-ranging collaboration to improve the overall semiconductor ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module ...

Santa Clara, Calif.—Agilent Technologies Inc. has integrated its full-wave 3D simulator Electromagnetic Design System (EMDS) into its Advanced Design System (ADS) EDA software platform. According to ...

Cadence Design Systems and NI announce a broad-ranging collaboration to improve the overall semiconductor development and test process of next-generation wireless, automotive and mobile integrated ...

Members can download this article in PDF format. In this design idea, you will learn how to interface two PIC microcontrollers using a wireless 433-MHz RF transmitter/receiver pair to control up to ...

The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 Amkor continues to innovate in advanced SiP technologies TEMPE, Ariz.--(BUSINESS WIRE)--Amkor ...

OYSTER BAY, N.Y., Oct. 26, 2020 /PRNewswire/ -- Global tech market advisory firm, ABI Research, using the teardown expertise of System Plus Consulting, unpacked two 5G smartphones to confirm that ...

TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new NanoRF modules and contacts, which ...

Radiation-tolerant, high-current-density DC-DC converter modules supply power to the AI1 transponder for innovative computing ...