Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

Product packaging is often overlooked as something unimportant. However, like an extension of the product itself, it can attract customers as well as build the brand's reputation. But the look of the ...

RICHMOND, Va.--(BUSINESS WIRE)--MeadWestvaco Corporation (NYSE: MWV), a global leader in packaging and packaging solutions, launched Packaging Matters, the company’s second annual study of the role ...

New flexible packaging films have a unique combination of performance, durability and easy scalability to help strengthen the broader recycling ecosystem, paving the way for stronger, cleaner ...