LG Innotek said on the 10th that it has developed a "next-generation smart integrated circuit (IC) substrate" that boosts performance while cutting carbon emissions to half of previous levels. It is ...

TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...