Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level package) process, ...