1、电子设备热设计的需求与日俱增，随着电子产品热流密度的增加，温度控制不当成为现代电子产品失效的主要原因。 2、产品热设计在整机中所占据的成本比重迅速增加，热设计逐渐成长为产品核心竞争力因素之一。 3、产品迭代升级加快，性能、成本竞争 ...

碳化硅功率器件具有耐高压、开关速度快和导通损耗低的优势，也逐渐成为新能源汽车、光伏发电、轨道交通、智能电网等领域电力变换系统的核心器件。 在额定电流和电压相同的前提下，碳化硅器件的尺寸比硅器件可以做到更小，这对高功率密度、高散热能力 ...

Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...

Ansys lessens barriers to entry, empowers students to enhance electronics-specific simulation skillset and spurs the next generation of innovation Free download expands students' online access to ...

Southpointe, Penn. – ANSYS, Inc. has announced ANSYS 12.1, which supports customers in Simulation Driven Product Development. The new release incorporates tools that further automate the product ...

Ansys lessens barriers to entry, empowers students to enhance electronics-specific simulation skillset and spurs the next generation of innovation Free download expands students’ online access to ...