Ahead of Display Week 2025, CEO Robert Ramsey, Ph.D., and Chief Scientist Michael Robinson, Ph.D., of Rain Technology today shared domain expert commentary and video explainers about the future for ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...

TORONTO--(BUSINESS WIRE)--Walnut, an innovative force in the insurance distribution industry, today announced the successful close of its latest funding round, securing $4.6M. The investment will be ...

The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

SAN FRANCISCO — Intel gave further details on its technique for embedding spin-transfer torque (STT)-MRAM into devices using its 22-nm FinFET process, pronouncing the technology ready for high-volume ...

Enea Embedded Technology, formerly OSE Systems, has announced version 5.0 of the OSE real-time operating system (RTOS). OSE is a compact, pre-emptive, memory-protected, multi-processor RTOS optimized ...

As the global aerospace and defense industry shifts into the 2020s, embedded systems suppliers are being tasked with supporting certifiable avionics architectures capable of meeting the most stringent ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

NUREMBURG, Germany--(BUSINESS WIRE)--Embedded World 2025 – Embedded World is one of the most influential exhibitions in the global embedded technology sector, attracting numerous experts in industrial ...

This file type includes high-resolution graphics and schematics when applicable. It looks like 2017 is shaping up to be an interesting year in the embedded-technology space—for a variety of reasons.