Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...

Santa Clara, California, April 22, 2026 (GLOBE NEWSWIRE) -- Alchip Technologies, Ltd., the high-performance AI and HPC ASIC ...

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions DURHAM, N.C.--(BUSINESS WIRE)-- Wolfspeed, Inc. (WOLF), a ...

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

A ribbon-cutting ceremony of a new advanced semiconductor research and development center in Union City marks the first such ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

This AI infrastructure leader could prove to be an exceptional pick in the long run.

CEO Michael Plisinski highlighted that Onto Innovation ended 2025 "on a high note with orders from 2.5D packaging for AI devices more than doubling in the quarter, contributing to a record revenue of ...

As artificial intelligence demand drives the global semiconductor industry toward a trillion-dollar scale in 2026, three ...

Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...